MengziThick-sheet thermoforming of PC, PMMA, and PETG

Thick-sheet thermoforming offers significant engineering and economic advantages; in the packaging manufacturing industry, unless corrugated cardboard is used as the packaging material, thick‑sheet blister‑forming technology cannot match the performance of other processing methods. The primary advantage of thick‑sheet blister forming lies in its cost‑effectiveness.

Product Description

Thick-sheet thermoforming offers significant engineering and economic advantages. In the packaging manufacturing industry, unless corrugated cardboard is used as the packaging material, thick-sheet blister‑forming technology cannot match the performance of other processing methods. The primary benefit of thick-sheet blister forming lies in its cost‑effectiveness. For products such as formed composite sheets, foamed sheets, and printed sheets, changes to the mold can be implemented without requiring modifications to the thick-sheet blister‑forming equipment. Thin-walled parts can be produced using high‑melt‑viscosity, thick sheets, whereas injection molding of parts with the same wall thickness requires low‑melt‑viscosity pellets. For small‑batch production, the favorable tooling costs represent another advantage of thick-sheet blister forming; for large‑volume runs, the ability to achieve extremely thin wall thicknesses, combined with the high production rates of thick-sheet thermoforming, makes it particularly advantageous.